LENOVO Server processor upgrade - 4XG7A63401

€ 2,375.00Excl. VAT

    No Stock   No Stock

    LENOVO Server processor upgrade

    Lenovo SR630 V2 Intel Xeon Gold 6326 16C 185W 2.9GHz Option Kit w/o Fan

    Item No:
    4XG7A63401
    € 2,375.00Excl. VAT

      No Stock  No Stock
        Manufacturer data
        • Processor
        • Processor family :Intel® Xeon® Gold
        • Processor cores :16
        • Processor socket :LGA 4189
        • Processor lithography :10 nm
        • Cooler included : No
        • Processor manufacturer :Intel
        • Processor model :6326
        • Processor base frequency :2.9 GHz
        • Processor operating modes :64-bit
        • Processor generation :3rd Generation Intel® Xeon® Scalable
        • Component for :Server/workstation
        • Processor series :Intel Xeon Gold 6000 Series
        • Processor threads :32
        • System bus rate :11.2 GT/s
        • Processor boost frequency :3.5 GHz
        • High priority cores :4
        • High priority core frequency :3 GHz
        • Low priority cores :12
        • Low priority core frequency :2.6 GHz
        • Processor cache :24 MB
        • Thermal Design Power (TDP) :185 W
        • Processor codename :Ice Lake
        • Processor ARK ID :215274
        • Memory
        • Memory channels :Octa-channel
        • Memory types supported by processor :DDR4-SDRAM
        • ECC : Yes
        • Graphics
        • On-board graphics card : No
        • Discrete graphics card : No
        • On-board graphics card model :Not available
        • Discrete graphics card model :Not available
        • Features
        • Execute Disable Bit : Yes
        • Maximum number of PCI Express lanes :64
        • PCI Express slots version :4.0
        • Supported instruction sets :SSE4.2, AVX, AVX 2.0, AVX-512
        • Scalability :2S
        • Embedded options available : Yes
        • Processor special features
        • Intel® Hyper Threading Technology (Intel® HT Technology) : Yes
        • Intel® Turbo Boost Technology :2.0
        • Intel® AES New Instructions (Intel® AES-NI) : Yes
        • Intel Trusted Execution Technology : Yes
        • Intel® Speed Shift Technology : Yes
        • Intel® Transactional Synchronization Extensions : Yes
        • Intel® Total Memory Encryption : Yes
        • Intel® Crypto Acceleration : Yes
        • Intel® Platform Firmware Resilience Support : Yes
        • Maximum Enclave Size Support for Intel® SGX :64 GB
        • Intel VT-x with Extended Page Tables (EPT) : Yes
        • Intel Software Guard Extensions (Intel SGX) : Yes
        • Intel 64 : Yes
        • Intel Virtualization Technology (VT-x) : Yes
        • Intel Virtualization Technology for Directed I/O (VT-d) : Yes
        • AVX-512 Fused Multiply-Add (FMA) units :2
        • Intel® Deep Learning Boost (Intel® DL Boost) on CPU : Yes
        • Intel® Resource Director Technology (Intel® RDT) : Yes
        • Intel® Volume Management Device (VMD) : Yes
        • Intel® Run Sure Technology : Yes
        • Mode-based Execute Control (MBE) : Yes
        • Intel® Optane™ DC Persistent Memory Supported : Yes
        • Operational conditions
        • Tcase :78 °C
        • Technical details
        • Supported memory types :DDR4-SDRAM
        • Target market :Cloud Computing
        • Launch date :Q2'21
        • Status :Launched
        • Memory speed (max) :3200 MHz
        • Number of UPI links :3
        • Servicing status :Baseline Servicing
        • Weight & dimensions
        • Processor package size :77.5 x 56.5 mm
        • Other features
        • Maximum internal memory :6 TB
        • Personal advice from bluelink
        ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.
        • The product can be used with the following products or groups
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